China Aluminum Base Copper Clad Laminate manufacturer & supplier

High Thermal Conductivity Adhesive Film

H-J-04

High thermal conductivity adhesive film use in the metal base copper clad laminate.

2015-01-02

Aluminium Base CCL Thermal Insulating Film

H-J-03

High thermal conductivity adhesive film use in the metal base copper clad laminate.

2015-01-02

High Thermal Conductive Insulating Film

H-J-02

High thermal conductivity adhesive film use in the metal base copper clad laminate.

2015-01-02

High Thermal Insulation Film for CCL

H-J-01

High thermal conductivity adhesive film use in the metal base copper clad laminate.

2015-01-02

Aluminum Base Copper Clad Laminate

AL-H-06

Aluminum Base Board , using thermal conductivity resin on the Al base surface,single side Copper Foil, and after hot-pressing process formed

2014-10-24

Copper Base Copper Clad Laminate

Cu-H-06

Copper Base Board , using thermal conductivity resin on the Cu base surface,single side Copper Foil, and after hot-pressing process formed

2014-10-24

Metal Base Copper Clad Laminate

AL-H-06

Aluminum Base Board , using thermal conductivity resin on the Al base surface,single side Copper Foil, and after hot-pressing process formed

2014-10-24

Copper Clad Laminate sheet-PCB raw material

AL-H-06

Aluminum Base Board , using thermal conductivity resin on the Al base surface,single side Copper Foil, and after hot-pressing process formed

2014-10-24

Rigid Copper Clad Laminate

AL-H-06

Aluminum Base Board , using thermal conductivity resin on the Al base surface,single side Copper Foil, and after hot-pressing process formed

2014-10-24

Single-sided Copper Clad Laminate

AL-H-06

Aluminum Base Board , using thermal conductivity resin on the Al base surface,single side Copper Foil, and after hot-pressing process formed

2014-10-24

Aluminum Copper Clad Laminate

AL-H-06

Aluminum Base Board , using thermal conductivity resin on the Al base surface,single side Copper Foil, and after hot-pressing process formed

2014-10-24

Copper Clad Laminate sheet

AL-H-06

Aluminum Base Board , using thermal conductivity resin on the Al base surface,single side Copper Foil, and after hot-pressing process formed

2014-10-24